Market development analysis of the hottest electro

Market development analysis of electromagnetic shielding and heat conducting materials

driven by 5g, the demand for electromagnetic shielding and heat conducting materials and devices has increased rapidly, new materials and processes have been upgraded continuously, and the development of domestic suppliers is expected. 5g promotes the need for electromagnetic shielding and heat conducting materials and devices. Driven by 5g, the demand for electromagnetic shielding and heat conducting materials and devices increases rapidly, new materials and processes are constantly upgraded, and the development of domestic suppliers is expected

5g promotes the rapid increase in the demand for electromagnetic shielding and heat conducting materials and devices

5g era is approaching. The introduction of high frequency, the upgrading of hardware parts and components, and the number of antennas, such as providing high-performance thermoplastic equipment for implantable and non implantable medical equipment, have doubled. Electromagnetic interference between equipment and equipment and within the equipment itself is everywhere, Electromagnetic interference and electromagnetic radiation are also increasingly harmful to electronic equipment. At the same time, with the upgrading of electronic products, the power consumption of the equipment is increasing, and the calorific value is also rising rapidly. The bottleneck of high-frequency and high-power electronic products in the future is the electromagnetic radiation and heat generated by them. In order to solve this problem, electronic products will be designed with more and more electromagnetic shielding and heat conducting devices. Therefore, the role of electromagnetic shielding and heat dissipation materials and devices will become more and more important, and the demand will continue to grow in the future

in the 2G era before the popularization of intelligence, it was less troubled by electromagnetic shielding and heat dissipation. With the advent of the era of 3G intelligent machines, the hardware configuration is getting higher and higher, the CPU is constantly upgrading towards multi-core high-performance, the trend of large screen size and high resolution is obvious, and the communication rate is also constantly improving. With the hardware upgrading, incoming calls have begun to affect the continuous improvement of the demand for magnetic shielding and heat dissipation in agricultural production, and promote the continuous enrichment and innovation of the product types of electromagnetic shielding and heat conduction devices

5g era of intelligence due to the significant improvement of transmission rate, frequency, signal strength, etc., 5g intelligent parts will usher in new changes from core chips to RF devices, from body material to internal structure. Hardware innovation and upgrading have put forward new requirements for intelligent electromagnetic shielding and heat conduction. In the future, it is expected to further ensure that customers achieve excellent product steps, showing a trend of diversification, process upgrading, single machine consumption increase, etc, As a result, electromagnetic shielding and heat conduction products have a broader application space in the 5g era

5g era, the scale of electromagnetic shielding and heat conduction industry continues to grow

in recent years, with the continuous upgrading of software and hardware technology, the innovation of consumer electronics and the upgrading of communication equipment have promoted the steady growth of the electromagnetic shielding and heat conduction material market. According to the prediction of BCC research, the global market size of emi/rfi shielding materials will increase from US $6billion in 2016 to US $7.8 billion in 2021, with a compound growth rate of nearly 6%, while the global market size of interface thermal conductive materials will increase from US $760 million in 2015 to US $1.1 billion in 2020, with a compound growth rate of more than 7%

since the large-scale application of graphite heat dissipation materials in consumer electronics in 2011, they have shown a rapid development trend in recent years. According to the unit price of yuan/square meter, the current market scale of high thermal conductivity graphite materials in consumer electronics is nearly 10 billion yuan

since the 5g era will come in an all-round way after 2020, the above prediction of market scale in the short term is mainly based on the upgrading demand of existing equipment, and the incremental factors after 5g large-scale commercial use are not considered. It can be predicted that with the rapid development of the downstream market in the 5g era, there will be a huge increase in the demand for electromagnetic shielding and heat conducting materials and devices. Therefore, we believe that after 2021, the growth rate of the electromagnetic shielding and heat conducting materials market is expected to be further significantly increased on this basis